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As the industry advances toward miniaturization and new materials composite on the wafer, the demand for wafer and individual die marking for traceability and identification has increased in the recent years. Capitalizing on our scanvision capability and laser knowledge, Hylax direct wafer die marking system is a fully automatic system designed for direct marking of dies in post sawn wafer form in wafer rings  and capable of processing up to 4” -8” wafer size.